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Handbook of Biochips

Integrated Circuits and Systems for Biology and Medicine

  • Mohamad Sawan
Living reference work

Table of contents

  1. Amine Bermak, Muhammad Hassan, Xiaofang Pan
  2. Aida Aberra, Young-Han Kim, Minkyu Je, Sohmyung Ha
  3. Shuenn-Yuh Lee, Chen-Yueh Huang
  4. Gang Wang, Dobromir Filip, Michael D. Poscente, Christopher N. Andrews, Martin P. Mintchev
  5. Jae Sun Lee, Rajamanickam Sivakumar, Nae Yoon Lee
  6. Kea-Tiong (Samuel) Tang, Hsin Chen, Yu-Po Lin
  7. Toshiya Arakawa, Noriaki Sakakibara, Shinji Kondo
  8. Takashi Tokuda, Jun Ohta
  9. Fan Zhang, Tan Yang, Jeremy Holleman, Brian Otis
  10. Clemens Eder, Andreas Demosthenous
  11. José Germano, Tiago Costa, Filipe A. Cardoso, José Amaral, Susana Cardoso, Paulo P. Freitas et al.
  12. Dejan B. Popović
  13. Marco Carminati, Giorgio Ferrari, Davide Bianchi, Marco Sampietro
  14. Shuenn-Yuh Lee, Mario Yucheng Su
  15. Emilia Noorsal, Hongcheng Xu, Kriangkrai Sooksood, Maurits Ortmanns
  16. Yingke Gu, Xiang Xie, Guolin Li, Zhihua Wang
  17. K. N. Glaros, M. L. Rogers, M. G. Boutelle, E. M. Drakakis
  18. Naser Pour Aryan, Albrecht Rothermel
  19. Torsten Lehmann, Louis H. Jung, Gregg J. Suaning, Nigel H. Lovell
  20. Byunghun Lee, Hyung-Min Lee
  21. Anil Kumar RamRakhyani, Gianluca Lazzi
  22. Ashraf Bin Islam, Daniel Costinett, Syed Kamrul Islam

About this book

Introduction

This book provides a broad survey of the field of biochips, including fundamentals of microelectronics and biomaterials interaction with various, living tissues, as well as numerous, diverse applications. Although a wide variety of biochips will be described, there will be a focus on those at the brain-machine interface. Analysis is included of the relationship between different categories of biochips and their interactions with the body and coverage includes wireless remote control of biochips and arrays of microelectrodes, based on new biomaterials.

Editors and affiliations

  • Mohamad Sawan
    • 1
  1. 1.School of EngineeringWestlake UniversityHangzhouChina

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-6623-9
  • Copyright Information Springer Science+Business Media, LLC, part of Springer Nature 2020
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Online ISBN 978-1-4614-6623-9
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