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Design for Manufacturability with Advanced Lithography

  • Book
  • © 2016

Overview

Authors:
  1. Bei Yu

    1. ECE Department, The University of Texas, Austin, USA

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    You can also search for this author in PubMed   Google Scholar

  2. David Z. Pan

    1. ECE Department, The University of Texas, Austin, USA

    View author publications

    You can also search for this author in PubMed   Google Scholar

  • Enables readers to tackle the challenge of layout decompositions for different patterning techniques
  • Presents a coherent framework, including standard cell compliance and detailed placement, to enable Triple Patterning Lithography (TPL) friendly design
  • Includes coverage of the design for manufacturability with E-Beam lithography

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Table of contents (6 chapters)

  1. Front Matter

    Pages i-xi
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  2. Introduction

    • Bei Yu, David Z. Pan
    Pages 1-6

  3. Layout Decomposition for Triple Patterning

    • Bei Yu, David Z. Pan
    Pages 7-51

  4. Layout Decomposition for Other Patterning Techniques

    • Bei Yu, David Z. Pan
    Pages 53-82

  5. Standard Cell Compliance and Placement Co-Optimization

    • Bei Yu, David Z. Pan
    Pages 83-109

  6. Design for Manufacturability with E-Beam Lithography

    • Bei Yu, David Z. Pan
    Pages 111-157

  7. Conclusions and Future Works

    • Bei Yu, David Z. Pan
    Pages 159-162

  8. Back Matter

    Pages 163-164
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Keywords

About this book

This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.

Authors and Affiliations

  • ECE Department, The University of Texas, Austin, USA

    Bei Yu, David Z. Pan

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