Low Dielectric Constant Materials for IC Applications
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Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 9)
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Introduction
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
Keywords
Dielectric Materials Integrated circuit manufacture Interconnects Low dielectric constant Permittivity Semiconductor integrated circuit packaging plasma etching thin film
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Bibliographic information
- DOI https://doi.org/10.1007/978-3-642-55908-2
- Copyright Information Springer-Verlag Berlin Heidelberg 2003
- Publisher Name Springer, Berlin, Heidelberg
- eBook Packages Springer Book Archive
- Print ISBN 978-3-642-63221-1
- Online ISBN 978-3-642-55908-2
- Series Print ISSN 1437-0387
- About this book