Abstract
The integration of SiLK semiconductor dielectric (trademark of The Dow Chemical Company) resin for advanced interconnect systems is discussed in this chapter. First, the intrinsic material properties are reviewed. Second, the integration of the SiLK dielectric resin is discussed for subtractive technologies, and third, the integration of the former is discussed for damascene integration schemes. The technological steps (spin coat and cure, patterning, and clean and metallization) required to produce an interconnect structure are discussed in detail. Special attention is given to the lithographic bene- fits that can be obtained when using SiLK semiconductor dielectric in the different schemes. Finally, a brief cost-of-ownership discussion is provided.
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Waeterloos, J.J. (2003). Integration of SiLK Semiconductor Dielectric. In: Ho, P.S., Leu, J.J., Lee, W.W. (eds) Low Dielectric Constant Materials for IC Applications. Springer Series in Advanced Microelectronics, vol 9. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-55908-2_10
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DOI: https://doi.org/10.1007/978-3-642-55908-2_10
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