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Batteryless mm-Wave Wireless Sensors

  • Hao Gao
  • Marion Matters-Kammerer
  • Dusan Milosevic
  • Peter G.M. Baltus

Part of the Analog Circuits and Signal Processing book series (ACSP)

Table of contents

  1. Front Matter
    Pages i-x
  2. Hao Gao, Marion Matters-Kammerer, Dusan Milosevic, Peter G. M. Baltus
    Pages 1-4
  3. Hao Gao, Marion Matters-Kammerer, Dusan Milosevic, Peter G. M. Baltus
    Pages 5-11
  4. Hao Gao, Marion Matters-Kammerer, Dusan Milosevic, Peter G. M. Baltus
    Pages 13-19
  5. Hao Gao, Marion Matters-Kammerer, Dusan Milosevic, Peter G. M. Baltus
    Pages 21-41
  6. Hao Gao, Marion Matters-Kammerer, Dusan Milosevic, Peter G. M. Baltus
    Pages 43-58
  7. Hao Gao, Marion Matters-Kammerer, Dusan Milosevic, Peter G. M. Baltus
    Pages 59-78
  8. Hao Gao, Marion Matters-Kammerer, Dusan Milosevic, Peter G. M. Baltus
    Pages 79-100
  9. Hao Gao, Marion Matters-Kammerer, Dusan Milosevic, Peter G. M. Baltus
    Pages 101-132
  10. Hao Gao, Marion Matters-Kammerer, Dusan Milosevic, Peter G. M. Baltus
    Pages 133-134
  11. Back Matter
    Pages 135-138

About this book

Introduction

This book describes the PREMISS system, which enables readers to overcome the limitations of state-of-the-art battery-less wireless sensors in size, cost, robustness and range, with a system concept for a 60 GHz wireless sensor system with monolithic sensors.  The authors demonstrate a system in which the wireless sensors consist of wireless power receiving, sensing and communication functions in a single chip, without external components, avoiding costly IC-interfaces that are sensitive to mechanical and thermal stress.

Keywords

mm-wave frequencies battery-less sensors RFID beam forming techniques RF phase shifting architecture

Authors and affiliations

  • Hao Gao
    • 1
  • Marion Matters-Kammerer
    • 2
  • Dusan Milosevic
    • 3
  • Peter G.M. Baltus
    • 4
  1. 1.Eindhoven University of TechnologyEindhovenThe Netherlands
  2. 2.Eindhoven University of TechnologyEindhovenThe Netherlands
  3. 3.Eindhoven University of TechnologyEindhovenThe Netherlands
  4. 4.Eindhoven University of TechnologyEindhovenThe Netherlands

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-72980-0
  • Copyright Information Springer International Publishing AG 2018
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-72979-4
  • Online ISBN 978-3-319-72980-0
  • Series Print ISSN 1872-082X
  • Series Online ISSN 2197-1854
  • Buy this book on publisher's site
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