Stimulation and Recording Electrodes for Neural Prostheses

  • Naser Pour Aryan
  • Hans Kaim
  • Albrecht Rothermel

Part of the SpringerBriefs in Electrical and Computer Engineering book series (BRIEFSELECTRIC, volume 78)

Table of contents

  1. Front Matter
    Pages i-xii
  2. Naser Pour Aryan, Hans Kaim, Albrecht Rothermel
    Pages 1-9
  3. Naser Pour Aryan, Hans Kaim, Albrecht Rothermel
    Pages 11-16
  4. Naser Pour Aryan, Hans Kaim, Albrecht Rothermel
    Pages 17-23
  5. Naser Pour Aryan, Hans Kaim, Albrecht Rothermel
    Pages 25-30
  6. Naser Pour Aryan, Hans Kaim, Albrecht Rothermel
    Pages 31-43
  7. Naser Pour Aryan, Hans Kaim, Albrecht Rothermel
    Pages 45-64
  8. Naser Pour Aryan, Hans Kaim, Albrecht Rothermel
    Pages 65-69
  9. Naser Pour Aryan, Hans Kaim, Albrecht Rothermel
    Pages 71-79
  10. Naser Pour Aryan, Hans Kaim, Albrecht Rothermel
    Pages 81-81

About this book

Introduction

This book provides readers with basic principles of the electrochemistry of the electrodes used in modern, implantable neural prostheses. The authors discuss the boundaries and conditions in which the electrodes continue to function properly for long time spans, which are required when designing neural stimulator devices for long-term in vivo applications. Two kinds of electrode materials, titanium nitride and iridium are discussed extensively, both qualitatively and quantitatively. The influence of the counter electrode on the safety margins and electrode lifetime in a two electrode system is explained. Electrode modeling is handled in a final chapter.

Keywords

Device Packaging Materials for Implantable Neural Prostheses Electrodes for Implantable Neural Prostheses Implantable ASICs for Neural Prostheses Implantable Neural Prostheses Neural Prostheses Neuroprosthetics

Authors and affiliations

  • Naser Pour Aryan
    • 1
  • Hans Kaim
    • 2
  • Albrecht Rothermel
    • 3
  1. 1.Institute of MicroelectronicsUniversity of UlmUlmGermany
  2. 2.Institute of MicroelectronicsUniversity of UlmUlmGermany
  3. 3.Institute of MicroelectronicsUniversity of UlmUlmGermany

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-10052-4
  • Copyright Information The Author(s) 2015
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-10051-7
  • Online ISBN 978-3-319-10052-4
  • Series Print ISSN 2191-8112
  • Series Online ISSN 2191-8120
  • About this book
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