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Particles on Surfaces 1

Detection, Adhesion, and Removal

  • Book
  • © 1988

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Editors:
  1. Kashmiri Lal Mittal

    1. IBM U.S. Technical Education, Thornwood, USA

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Table of contents (28 chapters)

  1. Front Matter

    Pages i-ix
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  2. General Papers

    1. Front Matter

      Pages 1-1
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    2. Fine Particles on Semiconductor Surfaces: Sources, Removal and Impact on the Semiconductor Industry

      • Stuart A. Hoenig
      Pages 3-16

    3. Cleaning Semiconductor Surfaces: Facts and Foibles

      • Arvind Khilnani
      Pages 17-35

    4. Effect of Chemical Cleaning Sequencing on Particle Addition/Reduction on Silicon Wafers

      • Charlie A. Peterson
      Pages 37-42

    5. Measuring Aerosol Particle Concentration in Clean Rooms and Particle areal Density on Silicon Wafer Surfaces

      • R. P. Donovan, B. R. Locke, D. S. Ensor
      Pages 43-56

    6. Particulate Contamination on Wafer Surfaces Resulting from Hexamethyldisilazane/Water Interactions

      • M. A. Logan, D. L. O’Meara, J. R. Monkowski, H. Cowles
      Pages 57-68

    7. Contamination of Chip Surfaces by Particles During Destructive Physical Analysis of Integrated Circuit Devices

      • J. J. Weimer, J. Kokosinski, M. R. Cook, M. Grunze
      Pages 69-76

    8. Calculation of Hamaker Coefficients for Metallic Aerosols from Extensive Optical Data

      • I. W. Osborne-Lee
      Pages 77-90

    9. Soiling Mechanisms and Performance of Anti-Soiling Surface Coatings

      • Edward F. Cuddihy
      Pages 91-111

    10. Implications of Particulate Contamination in the Performance of Floppy Disks

      • A. F. Lewis, R. J. Rogers
      Pages 113-125

  3. Particle-Substrate Interaction and Particle Adhesion

    1. Front Matter

      Pages 127-127
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    2. A Theoretical Review of Particle Adhesion

      • R. Allen Bowling
      Pages 129-142

    3. The Electrostatic Force on a Dielectric Sphere Resting on a Conducting Substrate

      • Wm. Y. Fowlkes, K. S. Robinson
      Pages 143-155

    4. Electrostatic Charge Generation on Wafer Surfaces and its Effect on Particulate Deposition

      • Mark Blitshteyn, Angel Martinez
      Pages 157-168

    5. Toner Adhesion in Electrophotography

      • M. H. Lee, A. B. Jaffe
      Pages 169-177

    6. Adhesion and Removal of Particles: Effect of Medium

      • M. B. Ranade, V. B. Menon, M. E. Mullins, V. L. Debler
      Pages 179-191

    7. Strong Adhesion of Dust Particles

      • Richard Williams, Richard W. Nosker
      Pages 193-199

    8. Prevention of Strong Adhesion of Dust Particles

      • Richard W. Nosker, Richard Williams
      Pages 201-210

    9. Dynamic Adhesion of Particles Impacting a Cylinder

      • Hwa-Chi Wang, Walter John
      Pages 211-224
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Keywords

About this book

This volume chronicles the proceedings of the Symposium on Particles on Surfaces: Detection, Adhesion and Removal held under the auspices of the Fine Particle Society in San Francisco, July 28-August 2, 1986. The study of particles on surfaces is extremely important in many areas of human endeavor (ranging from microelectronics to optics to biomedical). A complete catalog of modern precision and sophisticated technologies where particles on surfaces are of cardinal importance will be prohibitively long, but the following eclectic examples should underscore the concern about particles on a variety of surfaces. In the semiconductor world of shrinking dimensions, particles which, a few years ago, were cosmetically undesirable but functionally innocuous can potentially be killer defects now. As the device sizes get smaller, there will be more and more concern about smaller and smaller particles. In the information storage technology, the gap between the head and the disk is very narrow, and if a particle is trapped in the gap that can have very grave consequences. The implications of particulate contamination on sensitive optical surfaces is all too manifest. So the particulate contamination on surfaces is undesirable from functional, yield and reliability points of view. This symposium was organized with the following objectives in mind: to bring together active practitioners in this field; to provide a forum for discussion of the latest research and development activities in this area; to provide opportunity for cross-pollination of ideas; and to highlight topics which needed intensified effort.

Editors and Affiliations

  • IBM U.S. Technical Education, Thornwood, USA

    Kashmiri Lal Mittal

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