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Fine Particles on Semiconductor Surfaces: Sources, Removal and Impact on the Semiconductor Industry

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Particles on Surfaces 1

Abstract

The impact of fine particles and organic contamination on device yield is very serious. We have investigated several technologies in this area. They include: 1) Application of thermophoresis for the prevention of surface contamination. 2) The use of electrets for collection of particles that might otherwise settle on surfaces. 3) The use of dry ice snow as a cleaning medium for the removal of particulates and organic contamination.

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Author information

Authors and Affiliations

  1. Department of Electrical and Computer Engineering, University of Arizona, Tucson, Arizona, 85721, USA

    Stuart A. Hoenig

Authors
  1. Stuart A. Hoenig
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Editor information

Editors and Affiliations

  1. IBM U.S. Technical Education, 500 Columbus Ave., Thornwood, New York, 10594, USA

    Kashmiri Lal Mittal M.Sc. (First Class First), Ph.D. in Colloid Chemistry (Fellow of the American Institute of Chemists and Indian Chemical Society) (Fellow of the American Institute of Chemists and Indian Chemical Society)

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© 1988 Plenum Press, New York

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Hoenig, S.A. (1988). Fine Particles on Semiconductor Surfaces: Sources, Removal and Impact on the Semiconductor Industry. In: Mittal, K.L. (eds) Particles on Surfaces 1. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-9531-1_1

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  • DOI: https://doi.org/10.1007/978-1-4615-9531-1_1

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4615-9533-5

  • Online ISBN: 978-1-4615-9531-1

  • eBook Packages: Springer Book Archive

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