Abstract
Semiconductor fabrication processes involving contact and separation of processing media with wafer surfaces can leave a wafer electrostatically charged. It was shown theoretically that the electrostatic charge may have an effect on the rate of particle deposition on exposed wafer surfaces. In this paper the results of the experimental studies of static charge generation on wafer surfaces and particle deposition on charged wafers in semiconductor manufacturing environment are presented. It was observed that in a very clean environment of the Class 10 cleanroom the effect of electrostatic potentials of up to 6000 volts applied to the wafers on the rate of > 1 µm particle deposition on the wafer surfaces could not be demonstrated, while the effect was statistically significant in a less clean environment of the Class 10,000 cleanroom.
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References
B.Y.H. Liu, presented to the 32nd Annual Meeting of the Institute of Environmental Sciences, Dallas, 1986.
M. Yost and A. Steinman, Microcontamination, June 1986, p.18.
M. Blitshteyn, Evaluation Engineering, November, 1984, p.70.
B. J. Tullis, Microcontamination, December 1985, p.14.
J.C.R. Li, “Statistical Inference”, Vol.1, Edwards Brothers, Inc., Ann Arbor, Michigan, 1964.
B.A. Unger, R.G. Chemelli, and P.R. Bossard, presented at the 1984 EOS/ESD Symposium.
W.G. Cochran and G.M. Cox, “Experimental Design Second Edition”, John Wiley and Sons, New York, 1957, pp.117 -127.
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© 1988 Plenum Press, New York
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Blitshteyn, M., Martinez, A. (1988). Electrostatic Charge Generation on Wafer Surfaces and its Effect on Particulate Deposition. In: Mittal, K.L. (eds) Particles on Surfaces 1. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-9531-1_12
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DOI: https://doi.org/10.1007/978-1-4615-9531-1_12
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4615-9533-5
Online ISBN: 978-1-4615-9531-1
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