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Table of contents (15 chapters)
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High Frequency Issues
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Electrical Modeling of Packages
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Thermal Modeling
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Processing Issues with Packaging GaAs High Frequency Components
Keywords
About this book
Authors and Affiliations
Bibliographic Information
Book Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
Authors: Dean L. Monthei
Series Title: Electronic Packaging and Interconnects
DOI: https://doi.org/10.1007/978-1-4615-5111-9
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 1999
Hardcover ISBN: 978-0-7923-8364-2Published: 30 November 1998
Softcover ISBN: 978-1-4613-7325-4Published: 14 March 2014
eBook ISBN: 978-1-4615-5111-9Published: 27 November 2013
Series ISSN: 1389-2169
Edition Number: 1
Number of Pages: XIV, 234
Number of Illustrations: 62 b/w illustrations
Topics: Microwaves, RF and Optical Engineering, Control, Robotics, Mechatronics, Electrical Engineering
Industry Sectors: Aerospace, Electronics, IT & Software, Telecommunications