Abstract
There are three main methods for measuring semiconductor die temperatures: IR (infrared) microscope, liquid crystal, and correlation of an electrical parameter to temperature. the IR microscope and liquid crystal both require a clear view of the die surface. For plastic parts, a dummy package with the top machined out is used. Die are mounted in the open cavity and wirebonded. Thermocouples on the package case, board, and in ambient air provide reference temperatures to which die temperatures can be compared for determining ϴJC.
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References
Kaveh Azar, “Measuring Chip Temperatures With Thermochromic Liquids”, Electronics Cooling, January 1997
Hallcrest Inc.; Manufacturer of thermochromic liquid crystals, Glenview, IL, USA
Davis Liquid Crystals; Manufacturer of thermochromic liquid crystals, Leandro, CA, USA
LCImage, LLP: Manufacturer of liquid crystal imaging equipment, Newton, MA, USA
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© 1999 Springer Science+Business Media New York
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Monthei, D.L. (1999). Thermal Measurements. In: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications. Electronic Packaging and Interconnects Series, vol 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-5111-9_11
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DOI: https://doi.org/10.1007/978-1-4615-5111-9_11
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-7923-8364-2
Online ISBN: 978-1-4615-5111-9
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