Skip to main content

Basics of Thermal Analysis

  • Chapter
  • 230 Accesses

Part of the book series: Electronic Packaging and Interconnects Series ((EPAC,volume 2))

Abstract

Heat conduction occurs when two materials physically touch and one of the materials is hotter than the other. Heat conducted into a surrounding fluid or gas is treated as a special case and is referred to as convection. Heat can also be transmitted from surfaces by radiation (mainly by infrared light).

This is a preview of subscription content, log in via an institution.

Buying options

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   84.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD   109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Gordon N. Ellison, “Thermal Computations for Electronic Equipment”, Robert E. Krieger Publishing 1989

    Google Scholar 

  2. J.P.Holman, “Heat Transfer”, McGraw-Hill 1976

    Google Scholar 

  3. Frank P. Incropera, “Fundamentals of Heat Transfer”, John Wiley and Sons 1981

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

Copyright information

© 1999 Springer Science+Business Media New York

About this chapter

Cite this chapter

Monthei, D.L. (1999). Basics of Thermal Analysis. In: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications. Electronic Packaging and Interconnects Series, vol 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-5111-9_6

Download citation

  • DOI: https://doi.org/10.1007/978-1-4615-5111-9_6

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-7923-8364-2

  • Online ISBN: 978-1-4615-5111-9

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics