Abstract
Air bridges are used by a number of GaAs integrated circuit manufacturers. These are conductor runs suspended in air and supported by posts as shown in Figure 14.1.
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© 1999 Springer Science+Business Media New York
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Monthei, D.L. (1999). Production Process Issues. In: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications. Electronic Packaging and Interconnects Series, vol 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-5111-9_14
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DOI: https://doi.org/10.1007/978-1-4615-5111-9_14
Publisher Name: Springer, Boston, MA
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