Overview
- Focuses on the outcome of the of the European research project “FP7-ICT-2011-8 / 317882: Embedded Engineering Learning Platform” E2LP
- Proposes an Embedded Computer Engineering Learning Platform
- Captures project results and applications, methodologies, and evaluations
- Includes supplementary material: sn.pub/extras
Part of the book series: Advances in Intelligent Systems and Computing (AISC, volume 421)
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Table of contents (12 papers)
Keywords
About this book
This book focuses on the outcome of the European research project “FP7-ICT-2011-8 / 317882: Embedded Engineering Learning Platform” E2LP. Additionally, some experiences and researches outside this project have been included. This book provides information about the achieved results of the E2LP project as well as some broader views about the embedded engineering education. It captures project results and applications, methodologies, and evaluations. It leads to the history of computer architectures, brings a touch of the future in education tools and provides a valuable resource for anyone interested in embedded engineering education concepts, experiences and material. The book contents 12 original contributions and will open a broader discussion about the necessary knowledge and appropriate learning methods for the new profile of embedded engineers. As a result, the proposed Embedded Computer Engineering Learning Platform will help to educate a sufficient number of future engineers in Europe, capable of designing complex systems and maintaining a leadership in the area of embedded systems, thereby ensuring that our strongholds in automotive, avionics, industrial automation, mobile communications, telecoms and medical systems are able to develop.
Editors and Affiliations
Bibliographic Information
Book Title: Embedded Engineering Education
Editors: Roman Szewczyk, Ivan Kaštelan, Miodrag Temerinac, Moshe Barak, Vlado Sruk
Series Title: Advances in Intelligent Systems and Computing
DOI: https://doi.org/10.1007/978-3-319-27540-6
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing Switzerland 2016
Softcover ISBN: 978-3-319-27539-0Published: 20 January 2016
eBook ISBN: 978-3-319-27540-6Published: 19 January 2016
Series ISSN: 2194-5357
Series E-ISSN: 2194-5365
Edition Number: 1
Number of Pages: XII, 185
Number of Illustrations: 66 b/w illustrations, 12 illustrations in colour
Topics: Computational Intelligence, Technology and Digital Education, Educational Technology
Industry Sectors: Aerospace, Automotive, Biotechnology, Chemical Manufacturing, Consumer Packaged Goods, Electronics, Energy, Utilities & Environment, Engineering, Finance, Business & Banking, Health & Hospitals, IT & Software, Law, Materials & Steel, Oil, Gas & Geosciences, Pharma, Telecommunications