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More than Moore Technologies for Next Generation Computer Design

  • Rasit O. Topaloglu

Table of contents

  1. Front Matter
    Pages i-ix
  2. Dae Hyun Kim, Sung Kyu Lim
    Pages 1-22
  3. Yuan Xie, Qiaosha Zou
    Pages 23-48
  4. Xuanyao Fong, Sri Harsha Choday, Kaushik Roy
    Pages 49-72
  5. Seung H. Kang, Seong-Ook Jung
    Pages 73-99
  6. Peiyuan Wang, Enes Eken, Wei Zhang, Rajiv Joshi, Rouwaida Kanj, Yiran Chen
    Pages 101-125
  7. Cheng Li, Paul V. Gratz, Samuel Palermo
    Pages 155-186
  8. Christopher Condrat, Priyank Kalla, Steve Blair
    Pages 187-218

About this book

Introduction

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance.  Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”.  Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

Keywords

3D Integrated Circuits Emerging Memory for Integrated Circuits Low Power Integrated Circuits More than Moore Optical Interconnect Photonic Interconnect STT-MRAM Scalable Heterogeneous Memory

Editors and affiliations

  • Rasit O. Topaloglu
    • 1
  1. 1.IBMHopewell JunctionUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4939-2163-8
  • Copyright Information Springer Science+Business Media New York 2015
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4939-2162-1
  • Online ISBN 978-1-4939-2163-8
  • Buy this book on publisher's site
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