Fundamentals of Lead-Free Solder Interconnect Technology

From Microstructures to Reliability

  • Tae-Kyu Lee
  • Thomas R. Bieler
  • Choong-Un Kim
  • Hongtao Ma

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
    Pages 1-20
  3. Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
    Pages 21-50
  4. Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
    Pages 51-80
  5. Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
    Pages 81-112
  6. Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
    Pages 113-168
  7. Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
    Pages 169-210
  8. Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
    Pages 211-230
  9. Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
    Pages 231-249
  10. Back Matter
    Pages 251-253

About this book

Introduction

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. 

In summary, this book:

  •  Provides an up-to-date overview on lead-free soldering technologies
  •   Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique
  • Explores emerging technologies in lead-free soldering

Keywords

electromigration lead free soldering standards lead-free electronics lead-free solder alloys lead-free soldering solder joint reliability surface mount assembly tin whiskering

Authors and affiliations

  • Tae-Kyu Lee
    • 1
  • Thomas R. Bieler
    • 2
  • Choong-Un Kim
    • 3
  • Hongtao Ma
    • 4
  1. 1.Cisco Systems, Inc.San JoseUSA
  2. 2.Michigan State UniversityEast LansingUSA
  3. 3.Department of Materials Science and EngineeringUniversity of Texas, ArlingtonArlingtonUSA
  4. 4.Lightera Corp.SunnyvaleUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-9266-5
  • Copyright Information Springer Science+Business Media New York 2015
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-9265-8
  • Online ISBN 978-1-4614-9266-5
  • About this book
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