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Interconnection: The Joint

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Fundamentals of Lead-Free Solder Interconnect Technology

Abstract

The geometry of interconnections used in current electronic systems is described, and issues related to the reflow process that melts and re-solidifies the solder to make the interconnection are introduced.

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Authors and Affiliations

  1. Cisco Systems, Inc., San Jose, CA, USA

    Tae-Kyu Lee

  2. Michigan State University, East Lansing, MI, USA

    Thomas R. Bieler

  3. Department of Materials Science and Engineering, University of Texas, Arlington, Arlington, TX, USA

    Choong-Un Kim

  4. Lightera Corporation, Sunnyvale, CA, USA

    Hongtao Ma

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  1. Tae-Kyu Lee
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  2. Thomas R. Bieler
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  4. Hongtao Ma
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Lee, TK., Bieler, T.R., Kim, CU., Ma, H. (2015). Interconnection: The Joint. In: Fundamentals of Lead-Free Solder Interconnect Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4614-9266-5_2

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