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Fundamentals of Lead-Free Solder Interconnect Technology pp 231–249Cite as

Challenges in Future-Generation Interconnects: Microstructure Again

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Abstract

Understanding multifaceted microstructural evolution mechanisms is a key enabling foundation that will enable computational modeling and prediction of electronic system lifetimes before anything is built.

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Author information

Authors and Affiliations

  1. Cisco Systems, Inc., San Jose, CA, USA

    Tae-Kyu Lee

  2. Michigan State University, East Lansing, MI, USA

    Thomas R. Bieler

  3. Department of Materials Science and Engineering, University of Texas, Arlington, Arlington, TX, USA

    Choong-Un Kim

  4. Lightera Corporation, Sunnyvale, CA, USA

    Hongtao Ma

Authors
  1. Tae-Kyu Lee
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  2. Thomas R. Bieler
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  3. Choong-Un Kim
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  4. Hongtao Ma
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Lee, TK., Bieler, T.R., Kim, CU., Ma, H. (2015). Challenges in Future-Generation Interconnects: Microstructure Again. In: Fundamentals of Lead-Free Solder Interconnect Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4614-9266-5_8

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  • DOI: https://doi.org/10.1007/978-1-4614-9266-5_8

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  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4614-9265-8

  • Online ISBN: 978-1-4614-9266-5

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