A model for the etching of silicon in SF6/O2 plasmas K. R. RyanI. C. Plumb OriginalPaper Pages: 207 - 229
Spectroscopic diagnostics of temperature-controlled trench etching of silicon Ole KroghRobert N. CarlileRobert N. Nowlin OriginalPaper Pages: 231 - 246
Glow discharge deposition of silicon dioxide and aluminum oxide films: A kinetic model of the surface processes C. BourreauY. CatherineP. Garcia OriginalPaper Pages: 247 - 260
A mass spectrometric analysis of CF4/O2 plasmas: Effect of oxygen concentration and plasma power J. C. MartzD. W. HessW. E. Anderson OriginalPaper Pages: 261 - 275
Plasma polymerization of carbosilanes: Tetramethylsilane as a model monomer for reactivity study of silylmethyl groups A. M. WróbelG. CzeremuszkinJ. Kowalski OriginalPaper Pages: 277 - 289
Argon plasma transport properties at reduced pressures Seungho PaikE. Pfender OriginalPaper Pages: 291 - 304
Modeling of the plasma sintering process at reduced pressures Seungho PaikE. Pfender OriginalPaper Pages: 305 - 319
The temperature profiles in an argon plasma issuing into an argon atmosphere: A comparison of measurements and predictions A. H. DilawariJ. SzekelyC. B. Shaw OriginalPaper Pages: 321 - 337
Effect of quenching conditions on particle formation and growth in thermal plasma synthesis of fine powders Shrikant V. JoshiQibin LiangJames A. Batdorf OriginalPaper Pages: 339 - 358
Arc characteristics in small-scale DC plasma arc furnaces using graphite cathodes R. KnightM. J. MurawaK. J. Reide OriginalPaper Pages: 359 - 373