Plasma Chemistry and Plasma Processing
Plasma Chemistry and Plasma Processing is an international journal that provides a forum for the publication of original papers on fundamental research and new developments in plasma chemistry and plasma processing. The journal encompasses all types of industrial processing plasmas, ranging from nonthermal plasmas to thermal plasmas, and publishes fundamental plasma studies as well as studies of specific plasma applications. Application contexts of interest include plasma etching in microelectronics and other fields, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and others. Includes studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces.
Non-linear Compensated Dwell Time for Efficient Fused Silica Surface Figuring Using Inductively Coupled Plasma
- Journal Title
- Plasma Chemistry and Plasma Processing
- Volume 1 / 1981 - Volume 38 / 2018
- Print ISSN
- Online ISSN
- Springer US
- Additional Links
- Industry Sectors
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