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Infrared heating in the technology of soldering components in electronics

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Abstract

Parameters of infrared heating for soldering electronic components using surface mounting are investigated and optimized. The main advantages of IR heating are as follows: high rate, low lag effect, possibility to effectively change the temperature and time profile of heating, and the relative simplicity of the equipment.

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References

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Authors and Affiliations

  1. State University of Informatics and Radioelectronics of Belarus, ul. P. Brovki 6, Minsk, 220013, Republic of Belarus

    V. L. Lanin

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  1. V. L. Lanin
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Original Russian Text © V.L. Lanin, 2007, published in Elektronnaya Obrabotka Materialov, 2007, No. 5, pp. 91–96.

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Lanin, V.L. Infrared heating in the technology of soldering components in electronics. Surf. Engin. Appl.Electrochem. 43, 381–386 (2007). https://doi.org/10.3103/S1068375507050134

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  • DOI: https://doi.org/10.3103/S1068375507050134

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