Abstract
All previously mentioned fan-out technologies are using the round 200 or 300 mm wafers as the temporary carriers for making the molds, RDLs, etc. (This is because of the existing equipment for fabricating the device wafers.) In order to increase the throughput, fan-out panel-level packaging (FOPLP) has been proposed.
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Lau, J.H. (2018). Fan-Out Panel-Level Packaging (FOPLP). In: Fan-Out Wafer-Level Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-10-8884-1_9
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DOI: https://doi.org/10.1007/978-981-10-8884-1_9
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