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Adhesive and Its Application

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Surface Mount Technology
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Abstract

An adhesive in surface mounting is used to hold passive components on the bottom side of the board during wave soldering. This is necessary to avoid the displacement of these components under the action of the wave. When soldering is complete, the adhesive no longer has a useful function.

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References

  1. Estes, R.H., and Kulesza, F.W., “Surface mount technology—The epoxy alternative.” Proceedings, NEPCON West, February 1984, pp. 219–234.

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  2. Pound, Ronald., “Conductive epoxy is tested for SMT solder replacement.” Electronic Packaging and Production, February 1985, pp. 86–90.

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  3. Holt, Kenneth D., et al. “Use of indium alloy solder for microwave component attachment.” IPC Technical IPC-Paper TP-361, April 1982.

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  4. Meeks, S. “Application of surface mount adhesive to hot air leveled solder (HASL) circuit board evaluation of the bottom side adhesive dispense.” Paper IPC-TR-664, presented at the IPC fall meeting, Chicago, 1987.

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  5. Kropp, Philip and Eales, S. Kyle, Trouble shooting guide for surface mount adhesive, surface mount technology, August 1988, pp. 5051.

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  6. Aspandiar, R. Intel Corporation, internal report, February, 1987.

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© 1989 Van Nostrand Reinhold

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Prasad, R.P. (1989). Adhesive and Its Application. In: Surface Mount Technology. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6532-7_8

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  • DOI: https://doi.org/10.1007/978-94-011-6532-7_8

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-011-6534-1

  • Online ISBN: 978-94-011-6532-7

  • eBook Packages: Springer Book Archive

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