Surface Mount Technology

Principles and Practice

  • Ray P. Prasad

Table of contents

  1. Front Matter
    Pages i-xxiii
  2. Introduction to Surface Mounting

    1. Front Matter
      Pages 1-1
    2. Ray P. Prasad
      Pages 3-39
    3. Ray P. Prasad
      Pages 41-61
  3. Designing with Surface Mounting

    1. Front Matter
      Pages 63-63
    2. Ray P. Prasad
      Pages 65-112
    3. Ray P. Prasad
      Pages 113-162
    4. Ray P. Prasad
      Pages 163-207
    5. Ray P. Prasad
      Pages 209-233
  4. Manufacturing with Surface Mounting

    1. Front Matter
      Pages 267-267
    2. Ray P. Prasad
      Pages 269-309
    3. Ray P. Prasad
      Pages 311-347
    4. Ray P. Prasad
      Pages 349-386
    5. Ray P. Prasad
      Pages 387-421
    6. Ray P. Prasad
      Pages 423-470
    7. Ray P. Prasad
      Pages 471-513
    8. Ray P. Prasad
      Pages 515-563
  5. Back Matter
    Pages 565-610

About this book

Introduction

Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech­ nology to produce state-of-the-art miniaturized electronic products. How­ ever, in order to take advantage of this technology, a complete infrastruc­ ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor­ mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im­ plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.

Keywords

assembly ceramics electronics laser manufacturing metals packaging

Authors and affiliations

  • Ray P. Prasad
    • 1
  1. 1.Systems GroupIntel CorporationHillsboroUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-94-011-6532-7
  • Copyright Information Springer Science+Business Media B.V. 1989
  • Publisher Name Springer, Dordrecht
  • eBook Packages Springer Book Archive
  • Print ISBN 978-94-011-6534-1
  • Online ISBN 978-94-011-6532-7
  • About this book