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Surface Mount Components

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Surface Mount Technology

Abstract

Surface mount devices, active or passive, are functionally no different from their conventional through-hole counterparts. Thus the design and electrical function of an internal device is not unique to surface mounting, hence beyond the scope of this book. What is different in surface mounting is the packaging of those devices. Surface-mounted devices (SMDs) or components (SMCs) provide greater packaging density because of their smaller size.

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References

  1. ANSI/IPC-SM-782. 1987 Surface Mount Land Patterns (Configuration and Design Rules). IPC, Lincolnwood, IL.

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  2. Knuduson, E. “Surface mount packages for VLSI device.” Proceedings of the SMART III Conference January 1987. Technical paper SMT III-33. IPC, Lincolnwood, IL.

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  3. Smith, W. D. “The effect of lead coplanarity on PLCC solder joint strength.” Surface Mount Technology, June 1986, pp. 1317.

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  4. Honaryar, B. “Progress report on a pneumatic inspection device for coplanarity sensing of surface mounting PLCC.” Proceedings of the SMART III Conference, Technical paper III-19, IPC, Lincolnwood, IL, January 1987.

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  5. Derfiny, D., and Dody, G “On optimizing lead form.” NEPCON Proceedings, 1987, pp. 251–256.

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  6. Buckley, D. “SMC packaging causes problems. ”Electronic Production, April 1986, pp. 32–33.

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  7. Kang, S. K. and Moskowitz, P. A. IBM Technical Disclosure Bulletin, Vol. 29, No. 4, September 1986, pp. 1612.

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Author information

Authors and Affiliations

  1. Systems Group, Intel Corporation, Hillsboro, Oregon, USA

    Ray P. Prasad (SMT Program Manager)

Authors
  1. Ray P. Prasad
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© 1989 Van Nostrand Reinhold

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Prasad, R.P. (1989). Surface Mount Components. In: Surface Mount Technology. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6532-7_3

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  • DOI: https://doi.org/10.1007/978-94-011-6532-7_3

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-011-6534-1

  • Online ISBN: 978-94-011-6532-7

  • eBook Packages: Springer Book Archive

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