Abstract
The solder used in electronic assembly serves to provide electrical and mechanical connections. In through-hole mount assemblies we had to worry primarily about obtaining sound electrical connections, because the plated through holes imparted sufficient mechanical strength. With the advent of SMT, the role of the surface mount solder joint has become very critical, because it must provide both mechanical and electrical connections. The solder joint strength is controlled by the land pattern design and a good metallurgical bond between component and board.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Wassink, R. J. Soldering in Electronics. Ayr, Scotland: Electrochemical Publications, 1984.
Manko, H. H. Solders and Soldering, 2nd ed. New York: McGraw-Hill, 1984.
Bader, W. G. “Dissolution of Au, Ag, Pd, Pt, Cu, and Ni in molten tin-lead solder.” Welding Research Supplement, December 1969, pp. 551–557.
DeVore, J. “Fatigue resistance of solder.” NEPCON Proceedings, February 1982, pp. 409–414.
Wild, R. N. Some Fatigue Properties of Solders and Solder Joints. IBM Technical Report 73Z000421, January 1973.
Hart, C. “Double-sided attach using reflow solder.” NEPCON Proceedings, February 1985, pp. 46–53.
Keeler, R. “Specialty solders outshine tin/lead in problem areas”. EP & P, July 1987, pp. 45–47.
DeVore, J. A. “Solderability.” Journal of Metals, July 1984, pp. 51–53.
Wild, R. N. “Component lead solderability versus artificial steam aging, II.” Proceedings of the Naval Weapon Center Soldering Conference, January 1987, NWC TP 6789 pp. 299–320.
Mather, J. C. A Need for Tighter Requirements on Circuit Board Solderability. IPC-TP-484, September, 1983.
Mackay, C. A. “Surface finishes and their solderability.” Braz- ing and Soldering Supplement, Metal Fabrication, January/February 1979.
IPC-TR-462 Printed/board protective coating solderability evaluation over long term storage, Round Robin Test Program. October 1987, Lincolnwood.
Belani, J., Sajja, V., Mathew, R., and Patel, A. “Plated lead finishing for reliable solder joints.” NEPCON Proceedings, February 1986, pp. 467–470.
Geiger, A. L. “Solderability of capacitor lead wire.” Proceedings of the Naval Weapon Center, Soldering Conference, February 1986, NWC TP 6707, pp. 111–129.
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 1989 Van Nostrand Reinhold
About this chapter
Cite this chapter
Prasad, R.P. (1989). Metallurgy of Soldering and Solderability. In: Surface Mount Technology. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6532-7_10
Download citation
DOI: https://doi.org/10.1007/978-94-011-6532-7_10
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-011-6534-1
Online ISBN: 978-94-011-6532-7
eBook Packages: Springer Book Archive