Abstract
This paper is an introduction and overview of spectroscopic ellipsometric analysis of thin films, with special emphasis on plasma deposited and plasma etched materials. The intent is to illustrate the power of this recently enhanced technique for ex-situ post-process, and in-situ real-time microstructural analysis, and to discuss some issues not normally presented in papers.
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© 1997 Springer Science+Business Media Dordrecht
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Woollam, J.A. (1997). Ellipsometric Analysis of Plasma Deposited and Plasma Etched Materials. In: Williams, P.F. (eds) Plasma Processing of Semiconductors. NATO ASI Series, vol 336. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5884-8_20
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DOI: https://doi.org/10.1007/978-94-011-5884-8_20
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