Abstract
In order to allow accurate calculations of the temperature distribution throughout electtonic packages, the REBECA-3D Software, based on the Boundary Element Method, has been developed. The principles of this method for steady-state three-dimensional problems are given. It appears to be very well-adapted for parametric studies then for conception phase. It is finally applied to two cases of interest for engineers.
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Abbreviations
- \(\tilde{A},\tilde{B},\tilde{C} \ldots :\) :
-
matrices
- K:
-
conductivity
- Bi, Gij, Hij:
-
matrix coefficients
- nd :
-
number of domains
- p,Q:
-
points
- Q′:
-
heat generation
- T:
-
temperature
- Tc :
-
convective temperature
- R:
-
contact resistance
- h:
-
convective coefficient
- ϕ:
-
flux surface density
- Γ,Ω:
-
boundary, domain
- *:
-
fundamental functions
- _:
-
prescribed values
- ∼:
-
matrices
Bibliography
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© 1997 Springer Science+Business Media Dordrecht
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Fradin, J.P., Desaunettes, B. (1997). Calculations of The Temperature Distribution Throughout Electronic Equipments by The Boundary Element Method with the REBECA-3D Software. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_9
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DOI: https://doi.org/10.1007/978-94-011-5506-9_9
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6318-0
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