Thermal Management of Electronic Systems II

Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium

  • E. Beyne
  • C. J. M. Lasance
  • J. Berghmans

Table of contents

  1. Front Matter
    Pages i-xi
  2. Invited Lectures

  3. Analytical and Computational Thermal Modeling

  4. Thermal Characterisation

    1. Front Matter
      Pages 113-113
    2. W. Temmerman, W. Nelemans, T. Goossens, E. Lauwers, C. Lacaze
      Pages 125-136
    3. F. Christiaens, E. Beyne, W. Temmerman, K. Allaert, W. Nelemans
      Pages 137-148
    4. Are Bjorneklett, Gunnar Gustavsson
      Pages 159-166
    5. V. Lepaludier, Y. Scudeller
      Pages 167-177
    6. Valter Motta, Claudio M. Villa, Tiao Zhou
      Pages 187-194
    7. Areski Belache, Thierry Gautier, Jean Claude Boisde, Nicolas Leveau, Guy Paulet
      Pages 195-201
  5. Single and Multi-Phase Convective Cooling

  6. Measurement Techniques

    1. Front Matter
      Pages 281-281
    2. Oronzio Manca, Biagio Morrone, Sergio Nardini
      Pages 283-292
    3. E. R. Meinders, T. H. Vd Meer, C. J. Hoogendoorn, C. J. M. Lasance
      Pages 301-308
    4. J. Hennissen, W. Temmerman, J. Berghmans, K. Allaert
      Pages 309-318
  7. Thermomechanical Modelling

    1. Front Matter
      Pages 319-319
    2. L. Tielemans, G. Gregoris, L. de Schepper, M. D’Olieslaeghers
      Pages 321-328
    3. F. Christiaens, E. Beyne, J. Roggen, J. van Puymbroeck, M. Heerman
      Pages 339-348
  8. Back Matter
    Pages 361-361

About these proceedings


For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.


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Editors and affiliations

  • E. Beyne
    • 1
  • C. J. M. Lasance
    • 2
  • J. Berghmans
    • 3
  1. 1.IMECLeuvenBelgium
  2. 2.Philips B.V.EindhovenThe Netherlands
  3. 3.Catholic University LeuvenLeuvenBelgium

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