Abstract
This paper presents a study of heat transfer in a vertical stacking of plastic packages. The work is based on experiments and simulations. An experimental module, integrating a great number of temperature sensors, has been set up Temperature profiles, inside the module, have been measured and correlations with natural convection have been identified. An original compact model has been developed.
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References
M. YAMADA, T. KUDAISHI, 9th European Hybrid Microelectrooics Conference, Nice, 1993
C. VAL&al, l’Onde Electrique (in french), vol.74, no2, 1994
C. VAL, 9th European Hybrid Microelectronics Conference, Nice, 1993
Y. SCUDELLER-to be published
Allan D. KRAUS, in “advances in thermal modeling of electronic components and systems”, vol.2, pp41–106, 1990
Y. SCUDELLER, Société Française des Ihermiciens, Paris, 1994
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© 1997 Springer Science+Business Media Dordrecht
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Scudeller, Y., Val, C. (1997). Heat Transfer in a Vertical Stacking of Plastic Packages. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_7
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DOI: https://doi.org/10.1007/978-94-011-5506-9_7
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6318-0
Online ISBN: 978-94-011-5506-9
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