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Temperature as a Reliability Factor

We have a headache with Arrhenius

  • Conference paper
Thermal Management of Electronic Systems II

Abstract

Many reliability engineers and system designers consider temperature to be a major factor affecting the reliability of electronic equipment. Unfortunately, in an effort to improve reliability, design teams have often lowered temperature without fully understanding the impact on cooling system reliability, in dollars, weight, and size, and the extent of any actual reliability improvement.

Takehisa Okada, Senior General Manager of Sony Corporation, when asked about Sony’s perspective on reliability prediction methods during a U.S. Japanese Technology Evaluation Center visit [Kelly et al. 1993]

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Author information

Authors and Affiliations

  1. CALCE Electronic Packaging Research Center, University of Maryland, College Park, MD, 20742, USA

    Michael Pecht

  2. Radio Products Group, Motorola Inc., Plantation, FL, 33322, USA

    Pradeep Lall

  3. Component Reliability Branch, U.S. Army Research Laboratory, Fort Monmouth, NJ, 07703-5601, USA

    Edward Hakim

Authors
  1. Michael Pecht
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  2. Pradeep Lall
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  3. Edward Hakim
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Editor information

Editors and Affiliations

  1. IMEC, Leuven, Belgium

    E. Beyne

  2. Philips B.V., Eindhoven, The Netherlands

    C. J. M. Lasance

  3. Catholic University Leuven, Leuven, Belgium

    J. Berghmans

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© 1997 Springer Science+Business Media Dordrecht

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Pecht, M., Lall, P., Hakim, E. (1997). Temperature as a Reliability Factor. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_3

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  • DOI: https://doi.org/10.1007/978-94-011-5506-9_3

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-6318-0

  • Online ISBN: 978-94-011-5506-9

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