Abstract
A closed loop, two-phase thermosiphon system is an efficient method for dissipating high heat fluxes from a hot spot to a secondary coolant with a small temperature drop. At KTH in Stockholm, several prototypes of such systems have been built and tested over the past years. In this paper heat transfer coefficients for boiling and condensation with the refrigerants R142b, R134a, R22 and propane (R290) are presented, analysed and compared to correlations from the literature. The influence of channel diameter on boiling heat transfer is also examined.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Cooper, M.G., (1984), Heat Flow Rates in Saturated Pool Boiling-A Wide Ranging Examination Using Reduced Properties, in Advances in Heat Transfer, Vol. 16, ed. Harnett, J.P., and Irvine, T.F Jr., Academic Press, Orlando, Florida, USA.
Israelachvili, J., (1991), Intermolecular & Surface Forces, Second Edition, Academic Press.
Mesler, R., (1979), Boiling Phenomena, ed. van Stralen, S., and Cole, R., McGraw-Hill, Vol. 1, pp. 813–815.
NIST, (1994), refrigerant properties program “Refprop” version 4.01.
Nusselt, W., (1916), Surface Condensation of Water, Z. Ver. Ing., Vol. 60, pp. 569–575 and pp. 541–546.
Stephan, P., and Hammer, J., (1994), A new Model for Nucleate Boiling Heat Transfer, Wärme-und Stoffübertragung, Vol. 30, pp. 119–125.
Tengblad, N., and Palm, B., (1995), Two-Phase Thermosiphon for Cooling of Electronic Components, Advances in Electronic Packaging, Vol. 2, pp. 969–974.
VDI Heat Atlas, (1993), VDI-Verlag GmbH, Düsseldorf, Germany, pp. Hbb 1–33.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1997 Springer Science+Business Media Dordrecht
About this paper
Cite this paper
Tengblad, N., Palm, B. (1997). Flow Boiling and Film Condensation Heat Transfer in Narrow Channels of Thermosiphons for Cooling of Electronic Components. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_21
Download citation
DOI: https://doi.org/10.1007/978-94-011-5506-9_21
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6318-0
Online ISBN: 978-94-011-5506-9
eBook Packages: Springer Book Archive