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Flow Boiling and Film Condensation Heat Transfer in Narrow Channels of Thermosiphons for Cooling of Electronic Components

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Thermal Management of Electronic Systems II

Abstract

A closed loop, two-phase thermosiphon system is an efficient method for dissipating high heat fluxes from a hot spot to a secondary coolant with a small temperature drop. At KTH in Stockholm, several prototypes of such systems have been built and tested over the past years. In this paper heat transfer coefficients for boiling and condensation with the refrigerants R142b, R134a, R22 and propane (R290) are presented, analysed and compared to correlations from the literature. The influence of channel diameter on boiling heat transfer is also examined.

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References

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© 1997 Springer Science+Business Media Dordrecht

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Tengblad, N., Palm, B. (1997). Flow Boiling and Film Condensation Heat Transfer in Narrow Channels of Thermosiphons for Cooling of Electronic Components. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_21

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  • DOI: https://doi.org/10.1007/978-94-011-5506-9_21

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-6318-0

  • Online ISBN: 978-94-011-5506-9

  • eBook Packages: Springer Book Archive

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