Abstract
This paper focuses on the application of a fluid bath system for experimental thermal characterisation of electronic packages. Problems related to the standard method for Rjc and Rja measurements in a fluid bath environment are addressed. In order to overcome these problems and to increase the accuracy and repeatability of Rjc fluid bath measurements, a submerged liquid jet impingement cooling scheme is proposed. Using impinging liquid jets, a quasi isothermal boundary condition over the package surfaces can be obtained, minimising the external convective temperature difference. As a result, Rjc approximates Rjc, which can be measured without system disturbance effects. The advantages of this new experimental boundary condition for thermal characterisation of electronic packages will be illustrated with practical thermal resistance measurements on a Plastic Quad Flat Package (PQFP) and a Ceramic Pin Grid Array (CPGA).
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Temmerman, W., Nelemans, W., Goossens, T., Lauwers, E.., and Lazace, C: “Validation of Thermal Models for Electronic Components”, to be published in Proceedings IEPS, 1995.
Rosten, H.I. and Lasance, C.J.M.: “The Development of Libraries of Thermal Models of Electronic Components for an integrated Design Environment”, Proceedings IEPS, 1994.
Temmerman, W., Nelemans, W., Goossens, T., Lauwers, E., and Lazace, G: “Experimental Validation Methods for Thermal Models”, Proceedings EUROTHERM Seminar No 45,1995..
Sweet, J.N. and Cooley, W.T.: “Thermal Resistance Measurements and Finite Element Calculations for Ceramic Hermetic Packages”, Proceedings of the Sixth IEEE SEMI-THERM Symposium 1990, pp. 10–16.
Dutta, V.B.: “Junction-to-case Thermal Resistance — Still a Myth ?”, Proceedings of the Fourth IEEE SEMI-THERM Symposium 1988, pp. 8–11.
Shope, D.A., Fahey, W.J., Prince, J.L., and Staszak, Z.J.: “Experimental Thermal Characterization of VLSI Packages”, Proceedings of the Fourth IEEE SEMI-THERM Symposium 1990, pp. 19–24.
Kozarek, R.L.: “Effect of Case Temperature Measurement Errors on the Junction-to-Case Thermal Resistance of a Ceramic PGA”, Proceedings of the Seventh IEEE SEMI-THERM Symposium 1991, pp. 44–51.
Incropera, F.P. and Ramadhyani, S.: “Single-phase, Liquid Jet Impingement Cooling of High-performance Chips”, Proceedings NATO-ASI Cooling of Electronic Systems 1994, pp. 457–506.
Womac, D.J., Ramadhyani, S., and Incropera, F.P.: “Correlating Equations for Impingement Cooling of Small Heat Sources with Single Circular Liquid Jets”, ASME Journal of Heat Transfer Vol. 115, February 1993, pp. 106–115.
Moffat, R.J.: “Describing the Uncertainties in Experimental Results”, Experimental Thermal and Fluid Science, 1988, No l: pp. 3–17.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1997 Springer Science+Business Media Dordrecht
About this paper
Cite this paper
Christiaens, F., Beyne, E., Temmerman, W., Allaert, K., Nelemans, W. (1997). Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_13
Download citation
DOI: https://doi.org/10.1007/978-94-011-5506-9_13
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6318-0
Online ISBN: 978-94-011-5506-9
eBook Packages: Springer Book Archive