Abstract
This paper describes a first-order approach for the thermal simulation of electronic boards, intended especially to appreciate at an early stage of a design the effect of data change. This tool is conceived so as to ensure ease of use, interactivity and speed. These features are obtained by using an analytical numerical method allowing the instantaneous update of the board thermal map as the component placement is modified and minimizing the number of control parameters. This paper describes the principle of the method and investigates its accuracy using comparisons with experimental measurements.
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© 1997 Springer Science+Business Media Dordrecht
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Blanchard, J.L., Louage, S. (1997). An Interactive Thermal Characterization of Component Placement. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_10
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DOI: https://doi.org/10.1007/978-94-011-5506-9_10
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6318-0
Online ISBN: 978-94-011-5506-9
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