Abstract
The postprocessing module described in this paper enables the addition of a wide range of desired metal film, while maintaining compatibility with IC processing. When being able to combine any thin metal film with electronics, a new class of transducers becomes feasible with a performance often superior to existing silicon transducers. Although initially designed for transducer applications, the post-processing module is also capable of depositing metal film resistors for use as integrated passive components. Typical for the module are the flexibility of metal required, the flexibility of deposition order and the low temperature at which deposition takes place. Leaving the thermal budget of the electronics unaffected and the standard IC process intact, full compatibility with micro-electronic processing is assured. An example of the module is demonstrated in fabrication of low-TCR NiCr resistors.
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© 1998 Springer Science+Business Media Dordrecht
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Wijngaards, D., Bartek, M., Wolffenbuttel, R.F. (1998). IC Post-Processing Module for Deposition of Thin Metal Films. In: van den Berg, A., Bergveld, P. (eds) Sensor Technology in the Netherlands: State of the Art. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5010-1_39
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DOI: https://doi.org/10.1007/978-94-011-5010-1_39
Publisher Name: Springer, Dordrecht
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