Abstract
A new process for the fabrication of piezoelectric quartz thin films on silicon is investigated. With this process, new silicon-implemented acoustic wave delay lines for sensor applications can be realized. The process consists of low temperature fusion bonding of a piezoelectric quartz wafer to a silicon wafer followed by a back-lap of the quartz to a thickness of between 10 and 50 μm. In this contribution we report on the first step: the fusion bond process.
An annealing temperature of 140°C was found to be sufficient for further micromachining of the wafer stack.
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References
W.P. Mason, Measurement of the viscosity and shear elasticity of liquids by means of a torsionally vibrating crystal, Proc. A.S.M.E., 1947, 359–370
J.W. Grate, S.J. Martin, R.M. White, Acoustic wave Microsensors Pt. I, Anal. Chem. 65(21), 1993, 940–948
J.W. Grate, S.J. Martin, R.M. White, Acoustic wave Microsensors Pt. II, Anal. Chem. 65(22), 1993, 987–996
M.J. Vellekoop, G.W. Lubking, P.M. Sarro, A. Venema, Evaluation of liquid properties using a silicon Lamb wave sensor system, Sensors and Actuators A43, 1994, 175–180
D.R. Evans, M.F. Lewis, E. Patterson, Sputtered ZnO surface wave transducers, Electron. Lett. 7(18), 1971, 557–558
H.M. Liaw, W. Cronin, F.S. Hickernell, The SAW characteristics of sputtered aluminum nitride on silicon, Proc. IEEE Ultrasonic Symp., Baltimore, USA, 1993. 267–271
Ph. Luginbuhl, S.D Collins, G.-A. Racine, M.-A. Gretillat, N.F. de Rooij, K.G. Brooks, N. Setter, Flexural-plate-wave actuator based on PZT thin films, Proc. IEEE MEMS, Nagoya, Japan, 1997, 327–332
M.J. Vellekoop, Microfabrication of acoustic-wave devices, Proc. SPIE Symp. on Micromachined Devices and Components III, Austin, USA, 1997, 90–97
A. Berthold, M.J. Vellekoop, IC-compatible wafer-to-wafer bonding, Sensors and Actuators A 60, 1997, 208–211
A. Berthold, M.J. Vellekoop, IC-compatible wafer-to-wafer fusion bonding with SiO2 insulating layer, Eurosensors XI, Warsaw, Poland, 1997, 1373–1376
W.P. Maszara, G. Goetz, A. Caviglia, J.B. McKitterick, Bonding of silicon wafers for silicon-on-insulator, J. Appl. Phys. 64(10), 1988, 4943–4950
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© 1998 Springer Science+Business Media Dordrecht
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Berthold, A., Sarro, P.M., Vellekoop, M.J. (1998). Quartz-to-Silicon Fusion Bonding for Micro Acoustic Wave Applications. In: van den Berg, A., Bergveld, P. (eds) Sensor Technology in the Netherlands: State of the Art. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5010-1_34
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DOI: https://doi.org/10.1007/978-94-011-5010-1_34
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