Abstract
This paper presents a new technique of micromachining using single step electrochemical etching in hydrofluoric acid(HF). Using this etching technique, free standing beams with height, width and length of 40μm, 2μm and 250μm, respectively, are made of single crystal silicon. Basic concept of this etching technique is a combination of anisotropic and isotropic etching mode. First, trenches are made at a certain current density. After the desired depth is obtained, the current density is increased to enlarge the trench width without effecting the width of existing trenches. Finally, the trenches are connected under the beams. Thus free standing beams are obtained. After connection of the trenches, electropolishing occurs under the beams, so smooth silicon surface and desired gap length are also obtained.
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References
A Uhlir, “Electrolytic shaping of germanium and silicon”, Bell Tech. J. 35, pp. 333–347, 1956.
D. R. Turner, “Electropolishing silicon in HF acid solutions”, J. Electrochem. Soc. 105, pp. 402–408, 1958.
M. Esashi, H. Komatsu, T. Matsuo, M. Takahashi, T. Takishima, K. Imabayashi, and H. Ozawa, “Fabrication of catheter tips and sidewall miniature pressure sensors”, IEEE Trans. Electron Devices ED-29, pp. 57–63, 1982.
T. E. Bell, P. T. J. Gennissen, D. DeMunter, and M. Kuhl, “Porous silicon as a sacrificial material”, J. Micromech. Microeng. 6, pp. 361–369, 1996.
V. Lehmann, and U. Gosele, “Porous silicon formation: A quantum wire effect”, Appl. Phys. Lett. 58, pp. 856–858, 1991.
V. Lehmann, “The physics of macropore formation in low doped n-type silicon”, J. Electrochem. Soc. 140, pp. 2836–2843, 1993.
V. Lehmann, and H. Foll, “Formation mechanism and properties of electrochemically etched trenches in n-type silicon”,, J. Electrochem. Soc. 137, pp. 653–659, 1990.
S. Ottow, V. Lehmann, and H. Foll, “Processing of three-dimensional microstructures using macroporous n-type silicon”, J. Electrochem. Soc. 143, pp. 385–390, 1996.
V. Lehmann, “Porous silicon-a new material for MEMS”, IEEE MEMS Workshop’ 96, San Diego, USA, pp. 1–6, 1996.
H. Ohji, S. Lahteenmaki, and P. J. French, “Macro porous silicon formation for micromachining”, Proceedings SPIE, Micromachining and Microfabrication Process Technology III, Austin, Texas, USA, September 1997, pp. 189–197.
S. F. Chuang, S. D. Collins, and R. L. Smith, “Preferential propagation of pores during the formation of porous silicon: a transmission electron microscopy study”, Appl. Phys. Lett. 55, pp. 675–677, 1989.
M. J. J. Theunissen, “Etch channel formation during anodic dissolution of n-type silicon in aqueous hydrofluoric acid”, J. Electrochem. Soc. 119, pp. 351–360, 1972.
R. L. Smith, and S. D. Collins, “Porous silicon formation mechanisms”, J. Appl. Phys. 71(8), pp. Rl–R22, 1992.
X. G. Zhang, S. D. Collins, and R. L. Smith, “Porous silicon formation and electropolishing of silicon by anodic polarization in HF solution”, J. Electrochem. Soc. 136, pp. 1561–1565, 1989.
P. Steiner, and W. Lang, “Micromachining application of porous silicon”, Thin Solid Films 225, pp. 52–58, 1995.
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© 1998 Springer Science+Business Media Dordrecht
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Ohji, H., Trimp, P.J., French, P.J. (1998). Free Standing Beams Made by Single Step Electrochemical Etching in Hydrofluoric Acid. In: van den Berg, A., Bergveld, P. (eds) Sensor Technology in the Netherlands: State of the Art. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5010-1_32
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DOI: https://doi.org/10.1007/978-94-011-5010-1_32
Publisher Name: Springer, Dordrecht
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