Abstract
This paper is dedicated to the analysis of the needs and challenges of integration of CMOS and MEMS. It is acknowledged that individual sensors era is ending and the multi-sensor micro-systems era is beginning. On the example of cost requirements for IMU for high volume cell phone application it is demonstrated that achievement of required cost target is possible with monolithic MEMS CMOS integration. Among major challenges of this integration are: need for sensors sensitivity increase, as the way to scale their size down; process integration for different sensors and compatibility of this process with CMOS fabrication technology. General description of Siantis' technology, which met all major challenges of monolithic integration, is presented then. Finally, economic justification for monolithic integration is considered.
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Acknowledgments
I would like to express my gratitude to Dr. Nickolai Belov, my colleague, partner and friend for many years who contributed to the development of Siantis' technology and to some materials published in this paper.
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Vaganov, V. (2010). Challenges of Complete CMOS/MEMS Systems Integration. In: Gusev, E., Garfunkel, E., Dideikin, A. (eds) Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. NATO Science for Peace and Security Series B: Physics and Biophysics. Springer, Dordrecht. https://doi.org/10.1007/978-90-481-3807-4_2
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DOI: https://doi.org/10.1007/978-90-481-3807-4_2
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