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The Modeling of Electromigration A New Challenge for TCAD?

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Simulation of Semiconductor Processes and Devices 1998

Abstract

It is argued that the modeling of electromigration at the microscopic level results into systems of equations which can be very well addressed by state-of-the-art TCAD methods.

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© 1998 Springer-Verlag/Wien

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Schoenmaker, W., Petrescu, V. (1998). The Modeling of Electromigration A New Challenge for TCAD?. In: De Meyer, K., Biesemans, S. (eds) Simulation of Semiconductor Processes and Devices 1998. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6827-1_82

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  • DOI: https://doi.org/10.1007/978-3-7091-6827-1_82

  • Publisher Name: Springer, Vienna

  • Print ISBN: 978-3-7091-7415-9

  • Online ISBN: 978-3-7091-6827-1

  • eBook Packages: Springer Book Archive

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