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Electrothermal Device Simulation of an ESD Protection Structure Based on Bipolar DC Characteristics

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Simulation of Semiconductor Processes and Devices 2001
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Abstract

The high current characteristics of an ESD protection structure fabricated in a smart power technology is calculated by the use of electrothermal device simulation. We find reasonable agreement with experimental results after careful calibration of the technology-dependent transport parameters. The still existing differences between measurement and simulation results are discussed, together with some conclusions for the application of our simulation strategy in future.

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References

  1. A. Amerasekera and Ch. Duvvury: ESD in Silicon Integrated Circuits; J. Wiley & Sons, Chichester (1995)

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  4. K. Esmark et al.: Simulation and experimental study of temperature distribution during ESD stress in smart-power technology ESD protection structures; Proc. IRPS 2000, pp. 304–9

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  5. K. Esmark et al.: Advanced 2D/3D ESD Device Simulation ­ A Powerful Tool Already Used in a Pre-Si Phase; Proc. EOS/ESD 2000, pp. 420–9

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© 2001 Springer-Verlag Wien

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Deckelmann, A.I., Wachutka, G., Groos, G., Kanert, W. (2001). Electrothermal Device Simulation of an ESD Protection Structure Based on Bipolar DC Characteristics. In: Tsoukalas, D., Tsamis, C. (eds) Simulation of Semiconductor Processes and Devices 2001. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6244-6_91

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  • DOI: https://doi.org/10.1007/978-3-7091-6244-6_91

  • Publisher Name: Springer, Vienna

  • Print ISBN: 978-3-7091-7278-0

  • Online ISBN: 978-3-7091-6244-6

  • eBook Packages: Springer Book Archive

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