Investigation of a Novel Rapid Thermal Processing Concept Using an Electro-Optically Controlled Radiation Cavity

  • N. E. B. Cowern
  • F. Roozeboom
  • P. Van der Sluis
Conference paper


We present numerical investigations of a novel technique for reducing the thermal cycle during lamp-heated rapid-thermal processing (RTP). In our concept the reflective reactor-wall surface is replaced by an electro-optically switchable film, which allows efficient heating and subsequent radiative cooling of processed wafers. Our approach provides an efficient solution to ultrashallow junction requirements for forthcoming CMOS generations.


Thermal Cycle Wafer Surface Reactor Wall Efficient Heating Thermal Budget 
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    Based on U.S. patents 6,047,107 (4 April, 2000) and 6,173,116 (9 Jan., 2001) by Roozeboom F., Duine P.A. and Van der Sluis P; see also Roozeboom F., Van der Sluis P. and Cowern N.E.B., Electrochem. Soc. Symp. Proc. 2001–8 (2001) 41Google Scholar

Copyright information

© Springer-Verlag Wien 2001

Authors and Affiliations

  • N. E. B. Cowern
    • 2
  • F. Roozeboom
    • 1
  • P. Van der Sluis
    • 1
  1. 1.Philips ResearchProf. Holstlaan 4, 5656 AA EindhovenThe Netherlands
  2. 2.Surrey UniversityGuildfordU.K

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