Abstract
This paper reports the implementation of an elasto-plastic model in advanced stress simulation system within the process simulator IMPACT to predict the mechanical behavior of (poly)crystalline materials used in the microelectronic technologies. The benefits of this new model are a better prediction of the stresses magnitude in elasto-plastic materials, the capability to calculate the location and size of plastic area in silicon substrate and the possibility to analyze very accurately stresses evolution in (un)passivated metal interconnects networks, a serious reliability issue for the IC industry in the recent years.
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© 2001 Springer-Verlag Wien
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Senez, V., Hoffmann, T. (2001). Elasto-Plastic Modeling of Microelectronics Materials for Accurate Prediction of the Mechanical Stresses in Advanced Silicon Technologies. In: Tsoukalas, D., Tsamis, C. (eds) Simulation of Semiconductor Processes and Devices 2001. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6244-6_13
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DOI: https://doi.org/10.1007/978-3-7091-6244-6_13
Publisher Name: Springer, Vienna
Print ISBN: 978-3-7091-7278-0
Online ISBN: 978-3-7091-6244-6
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