Abstract
We present an enhanced smoothing algorithm in order to minimize the number of nodes in a surface triangulation while at the same time the wafer topography is maintained, and changes of geometry are limited to user-defined tolerances. Refined criteria for the protection of nodes and edges which have not to be removed because of topological reasons have been worked out. An algorithm has been implemented for the extraction of local smoothing tolerance. The use of local and material-dependent smoothing tolerance is mandatory for the optimization of surface triangulations. Our topologically correct smoothing algorithms with user-controlled tolerances provides large opportunities for increased efficiency of 3D simulation of various process steps. Some examples for this application are given.
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© 2004 Springer-Verlag Wien
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Nguyen, PH., Burenkov, A., Lorenz, J. (2004). Adaptive Surface Triangulations for 3D Process Simulation. In: Wachutka, G., Schrag, G. (eds) Simulation of Semiconductor Processes and Devices 2004. Springer, Vienna. https://doi.org/10.1007/978-3-7091-0624-2_38
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DOI: https://doi.org/10.1007/978-3-7091-0624-2_38
Publisher Name: Springer, Vienna
Print ISBN: 978-3-7091-7212-4
Online ISBN: 978-3-7091-0624-2
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