Abstract
Deposition of thin-films used in MEMS and NEMS devices rely on a wide variety of technologies. Physical vapor deposition (PVD) uses physical effects like evaporation or ion bombardment to create thin-films on a substrate by forcing source atoms into a gaseous phase. Chemical vapor deposition (CVD) and similar processes create coatings by a chemical reaction of volatile species by using reaction processes defined by chemical reaction equations. While PVD and CVD are dry processes, for depositing conductive thin-films the substrate may be submerged in an electrically conductive liquid (an electrolyte) and subjected to electrochemical or chemical deposition. Spin-coating and spray-coating are two examples of technologies that lend themselves to creating organic films—a technology widely used in depositing photoresists in photolithography. Dip processes like solgel may be used for the creation of oxide coatings.
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Notes
- 1.
Heinrich Hertz was a brilliant scientist who passed away at the age of only 37. He is most famous for providing experimental proof for Maxwell’s Laws and converting Maxwell’s equations into a more practical form [20].
- 2.
An electron volt (eV) is the amount of energy an electron gains when traveling through an electric potential of one volt. 1 electron volt = 1.6 × 10−19 joule [1].
- 3.
English pronunciation: deh-BYE (rhymes with cry).
- 4.
For more information about HARMST , see Chap. 7.
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Gatzen, H.H., Saile, V., Leuthold, J. (2015). Deposition Technologies. In: Micro and Nano Fabrication. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-44395-8_3
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