Abstract
The arsenal of technologies for silicon micromachining comprises photolithography, thin film deposition, doping, etching by wet chemicals and plasmas and waferbonding. Mainly for the sake of clarity and to describe the notions necessary to understand the limits and possibilities of micromachining we give a brief account of these fabrication methods. More information on silicon micromachining can be found in the literature mentioned in the text and in a few recent textbooks (Büttgenbach 1991, Elwenspoek 1999, Heuberger 1989, Kovacs 1998, Madou 1997, Menz 1993, Muller 1991, Muller 1999, Ristic 1994, Sze 1994, Tabib-Azar 1998).
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© 2001 Springer-Verlag Berlin Heidelberg
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Elwenspoek, M., Wiegerink, R. (2001). Silicon Micromachining. In: Mechanical Microsensors. Microtechnology and MEMS. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-04321-9_3
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DOI: https://doi.org/10.1007/978-3-662-04321-9_3
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-08706-6
Online ISBN: 978-3-662-04321-9
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