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Mechanical Microsensors

  • Miko Elwenspoek
  • Remco Wiegerink

Part of the Microtechnology and MEMS book series (MEMS)

Table of contents

  1. Front Matter
    Pages I-X
  2. Miko Elwenspoek, Remco Wiegerink
    Pages 1-4
  3. Miko Elwenspoek, Remco Wiegerink
    Pages 5-23
  4. Miko Elwenspoek, Remco Wiegerink
    Pages 24-58
  5. Miko Elwenspoek, Remco Wiegerink
    Pages 59-84
  6. Miko Elwenspoek, Remco Wiegerink
    Pages 97-131
  7. Miko Elwenspoek, Remco Wiegerink
    Pages 132-152
  8. Miko Elwenspoek, Remco Wiegerink
    Pages 153-208
  9. Miko Elwenspoek, Remco Wiegerink
    Pages 209-228
  10. Miko Elwenspoek, Remco Wiegerink
    Pages 229-258
  11. Miko Elwenspoek, Remco Wiegerink
    Pages 259-273
  12. Back Matter
    Pages 274-295

About this book

Introduction

Fabrication technologies related to those which are exploited for the fabrication of integrated circuits can be used to machine mechanical structures with minimum feature sizes in the range of micrometers. The mechanical machining of silicon based on IC-technologies is known as micromachining, and the systems made by micromachining are called MEMS (microelectromechanical systems). The present book describes how to use this technology to fabricate sensors of miniature size for mechanical quantities, such as pressure, force, flow and acceleration. The book includes a chapter with a comprehensive description of the relevant micromachining processes, and an introduction to MEMS, a field much broader than just microsensors. Most of these sensors rely on a deformation of the mechanical construction by an external load, and on a transduction mechanism to convert the deformation into a mechanical signal. The fundamental mechanics and electromechanics required for the understanding and the design of mechanical microsensors are described on a level accessible to engineers of all disciplines. Students in engineering sciences from the third year on should be able to benefit from this description. The most important mechanical sensors are described and discussed in detail with respect to fabrication issues, function and performance. Special emphasis is given to pressure sensors, force sensors, accelerometers, gyroscopes and flow sensors. Electronic interfacing, and a discussion of electronic circuits used for the sensors is also included. Finally the problem of packaging is addressed.

Keywords

Gauge Sensor deformation design friction heat transfer mechanical engineering mechanics mechanism microelectromechanical system (MEMS) scaling semiconductor sensors stress

Authors and affiliations

  • Miko Elwenspoek
    • 1
  • Remco Wiegerink
    • 1
  1. 1.MESA Research InstituteTwente University of TechnologyEnschedeThe Netherlands

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-662-04321-9
  • Copyright Information Springer-Verlag Berlin Heidelberg 2001
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Springer Book Archive
  • Print ISBN 978-3-642-08706-6
  • Online ISBN 978-3-662-04321-9
  • Series Print ISSN 1615-8326
  • Buy this book on publisher's site
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