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Packaging

  • Miko Elwenspoek
  • Remco Wiegerink
Part of the Microtechnology and MEMS book series (MEMS)

Abstract

Packaging of microsensors presents special problems: part of the sensor requires environmental access while the rest may require protection from environmental influences. This is schematically illustrated in Fig. 11.1 (Senturia 1988). Due to this special role of the package, it is important that the package is designed simultaneously with the sensor. At the very least some time should be spent on examining the feasibility of a package. Otherwise, one may end up with a sensor that requires an extremely expensive package or cannot be packaged at all.

Keywords

Pressure Sensor Sensor Chip Solder Bump Lead Frame Capacitive Pressure Sensor 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2001

Authors and Affiliations

  • Miko Elwenspoek
    • 1
  • Remco Wiegerink
    • 1
  1. 1.MESA Research InstituteTwente University of TechnologyEnschedeThe Netherlands

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