Abstract
The advances made in UHV SIMS instrumentation (scanned ion probe/quadrupole analyser) have increased analytical capabilities in several areas: depth profiling using high current reactive ion (O2, Cs) or inert-gas ion probes, with or without oxygen gas flooding, has achieved extremes in depth resolution or detection limits [1], particularly in semiconductor materials; sub-micron spatial resolution using scanned liquid metal field-ion source, LMFIS, probes of Ga, In, Au [2,3] and Cs [4], and the SIMS application of these ions has been demonstrated in elemental imaging, spectral analysis, line scans and depth profiles of a variety of samples including oxide-insulators of multi-layer or fibre structure [4,5] and polymer fibre [6] as well as semiconductor device structures [4,7]; imaging molecular or “STATIC” SIMS on polymer materials has been demonstrated [8] with coincident ion and electron beams (to maintain charge neutrality) while the introduction of neutral fast-atom beams, “FAB”, has made the spectral analysis of all types of insulators as easy as for conductors. The latest addition is the scanned FAB probe [9] which should make molecular imaging of insulators at 5–10 micron resolution a realistic possibility. In pace with these advances in primary probes the collection efficiency of the best quadrupoles has been improved to around the 1% level,so that the potential of SIMS for 3D micro-volume analysis either at the trace-element level or at the major molecular species level is now being realised in UHV.
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A.J. Eccles, J.A. van den Berg, A. Brown and J.C. Vickerman to be published
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© 1986 Springer-Verlag Berlin Heidelberg
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Bayly, A.R., Fathers, D.J., Vohralik, P., Walls, J.M., Waugh, A.R., Wolstenholme, J. (1986). Application of a Framestore Datasystem in Imaging SIMS. In: Benninghoven, A., Colton, R.J., Simons, D.S., Werner, H.W. (eds) Secondary Ion Mass Spectrometry SIMS V. Springer Series in Chemical Physics, vol 44. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-82724-2_67
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DOI: https://doi.org/10.1007/978-3-642-82724-2_67
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