Abstract
It is well known that the presence of electronegative atoms like oxygen or nitrogen on a sample surface can enhance the probability p+ of positive secondary ion emission in the sputtering process under noble gas ion bombardment by several orders of magnitude. There is, however, still some uncertainty about the physical origin of this large chemical enhancement. The strong increase of p+ could be either due to local bonding configurations upon chemisorption of electronegative gases (“bond breaking model” [1]), or, on the other hand, caused by changes in the (global) electronic band structure, as it has been shown for the enhancement of the negative ionization probability p− on alkali adsorption (“resonant tunneling mechanism” [2]). In this paper, we present energy and angle-resolved static mode SIMS data from oxygenated and nitrogenated Si(100) surfaces obtained under well defined experimental conditions, which strongly favor the local bond breaking model.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
P. Williams: Surface Sci. 90, 588 (1979)
G. Slodzian: Physica Scripta T6, 54 (1982)
P. J. Martin, A. R. Bayly, R. J. MacDonald, N. H. Tolk, G. J. Clark and J. C. Kelly: Surface Sci. 60, 349 (1976)
M. L. Yu: Phys. Rev. Lett. 47 1325 (1981)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1986 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Mann, K., Yu, M.L. (1986). Origin of the Chemical Enhancement of Positive Secondary Ion Yield in SIMS. In: Benninghoven, A., Colton, R.J., Simons, D.S., Werner, H.W. (eds) Secondary Ion Mass Spectrometry SIMS V. Springer Series in Chemical Physics, vol 44. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-82724-2_3
Download citation
DOI: https://doi.org/10.1007/978-3-642-82724-2_3
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-82726-6
Online ISBN: 978-3-642-82724-2
eBook Packages: Springer Book Archive