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Obstacles to High Temperature Cyclic Structural Durability of Continuous-Fiber MMCs

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Computational Mechanics ’95

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Abstract

Increases in high temperature cyclic structural durability are being sought constantly. Materials for the next generations of machines must be designed to resist higher stresses and strains, and for elevated temperature use, must also resist time-dependent, thermally-activated damage mechanisms such as creep and oxidation. If mission usage involves temperature excursions, thermal-gradient induced stresses and strains will be superimposed on mechanical stresses and strains. The combined strains adversely interact with environmental attack mechanisms. The end result is a complex cyclic variation of strain, stress and temperature, with time-dependent creep, diffusion, oxidation, etc.

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References

  1. C.W.Richards, Engineering Materials Science, Wadsworth, San Francisco, 1961.

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  2. G.R.Halford, B.A. Lerch, J.F. Saltsman and V.K. Arya, ASTM STP 1186, 1993, p. 176.

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  3. B.A.Lerch and G.R. Halford, Accepted for Materials Science and Engineering, 1995.

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  4. G.R.Halford, Thermal Stresses II, Chapter 6, North-Holland, Amsterdam, pp. 329–428.

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  5. D.W.Petrasek, NASA-Lewis Res. Center, Cleveland, OH, Personal Communication.

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Author information

Authors and Affiliations

  1. Lewis Research Center, NASA, Cleveland, Ohio, USA

    Gary R. Halford

Authors
  1. Gary R. Halford
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Editor information

Editors and Affiliations

  1. Computational Modeling Center, Georgia Institute of Technology, Atlanta, GA, 30332-0356, USA

    S. N. Atluri

  2. Department of Quantum Engineering & Systems Science, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113, Japan

    G. Yagawa

  3. Department of Mechanical Engineering, Vanderbilt University, P.O. Box 1592, Station B, Nashville, TN, 37235, USA

    Thomas Cruse

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© 1995 Springer-Verlag Berlin Heidelberg

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Halford, G.R. (1995). Obstacles to High Temperature Cyclic Structural Durability of Continuous-Fiber MMCs. In: Atluri, S.N., Yagawa, G., Cruse, T. (eds) Computational Mechanics ’95. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-79654-8_182

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  • DOI: https://doi.org/10.1007/978-3-642-79654-8_182

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-79656-2

  • Online ISBN: 978-3-642-79654-8

  • eBook Packages: Springer Book Archive

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